Gas Barrier Encapsulation Materials
MS seriesGas Barrier Encapsulation Materials MS series

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  3. Gas Barrier Encapsulation Materials MS series

Relates to our barrier films (MS-Fseries) having a water vapor barrier performance of 10-4 g/m2/day or lower and sealing materials(MS-A series). These films contribute to a lower weight and greater flexibility in devices, including organic EL devices (displays and lighting), organic solar cells, and electronic paper.

Gas Barrier Encapsulation Materials MS series usage image

Car roof lighting

Thin film solar cell

Gas Barrier film MS-F series

Composition

Features

High water vapor barrier property

High transparency , low haze

Neutral color

High flexibility

High heat resistance

Optical isotropy (optical isotropic type)

* Excellent barrier properties for gases other than water vapor (H2, O2, etc.)

Product Line-up

Product MS-F0025P MS-F0050P MS-F2050P
PET
Structure
Thickness 25 μm 50 μm
T.t.[%]a 91 91 88
Haze(%) b 1.0 1.0 1.0
a * [-]c -0.2 -0.2 -0.2
b* [-]c 0.8 0.8 0.8
WVTR [g・m -2 ・day -1 ] d 6.0 x 10 -3 6.0 x 10 -3 5.0 x 10 -4

*1 Measuring method : JIS K 7136
*2 Measuring method : JIS K7361-1
*3 Measuring method : JIS Z8729
*4 Measuring instrument : AQUATRAN-2  E398 -03 , Test environment: 40℃,90%RH

Catalog Download

Gas Barrier film MS-F series
Catalog PDF (263KB)

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Sealing adhesive materials MS-A series

Relates to our sealing adhesive materials (MS-A) having excellent durability and adhesion.
These materials contribute as a high reliable sealing adhesive to a lower weight and greater flexibility in devices, including organic EL devices (displays and lighting), organic solar cells, and electronic paper.

Composition

Features

High gas barrier property

High adhesion(prevention of instrusion from the bonding interface)

High tranparency, low haze

Neutral color

High flexibility

Excellent low dielectric property

Product Line-up

Name MS-A3010P MS-A3010Q Development product
Adhesive Type Thermal curing
High modulus Low modulus Low dielectric constant
Structure Lighter release liner 38 μm Lighter release liner 38 μm Lighter release liner 38 μm
Adhesive 10 μm Adhesive 10 μm Adhesive 15 μm
Heavier release liner 75 μm Heavier release liner 75 μm Heavier release liner 75 μm
Curing condition 90-100℃ - 1 hour 90-100℃ - 1 hour 160℃ - 1 hour
T.t.[%] *1 > 90 > 90 > 90
Haze(%) *2 < 1 < 1 < 1
b* *3 < 0.5 < 0.5 < 1
Adhesion to glass
[N/25 mm] *4
30 10 -
WVTR
(g・m -2 ・day-1 )*5
30 50 -
Dielectric constant DK:2.5, Df:0.009@1GHz Dk:3.0, Df:0.03@1GHz Dk:2.4, Df:0.002@1GHz
Dk:2.2, Df:0.002@10GHz

*1 Measuring method : JIS K 7136
*2 Measuring method : JIS K7361-1
*3 Measuring method : JIS Z8729
*4 Measuring method : JIS Z0237
*5 Measuring method : Lissi method ASTM E398 -03 , Test environment: 40℃,90%RH(Thickness 100μm)

Catalog Download

Sealing adhesive materials MS-A series
Catalog PDF (151KB)

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Gas Barrier Encapsulation Materials MS series

Our barrier films (MS-F series) and sealing materials (MS-A series) have a water vapor barrier performance of 10-4 g/m2/day or lower. These films contribute to a lower weight and greater flexibility in devices, including organic EL devices (displays and lighting), organic solar cells, and electronic paper.

Product Information